News / Taiwan / cnyes
GPM Semiconductor Pivot Pays Off: Orders Double for H2 with Backlog Extending to 2027
Electronic Technology · Semiconductors · cnyes · 2026-08-31
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GPM Chairman Chen Cheng-hsing reports strong demand for advanced packaging equipment, with H2 orders doubling and visibility extending through 2027.
What Happened
Successful Strategic Pivot: GPM has successfully transitioned its core business from the panel industry to semiconductor equipment over the past five years, with semiconductor operations now accounting for over 60% of revenue. The company is currently capitalizing on its focus on advanced packaging, wafer reclamation, and specialized substrates as products pass customer validation.
Technological Edge and Market Share: The company leverages its core expertise in inspection and grinding/polishing technologies to capture market share. Notably, its white-light interferometry equipment has successfully replaced industry leader KLA in certain testing applications, while its grinding and planarization tools are seeing increased demand due to the rise of AI server power management requirements.
Robust Order Momentum: Chairman Chen noted that H2 order intake is expected to more than double compared to the first half of the year. Due to extended lead times for critical components and high capacity utilization, the company has secured orders extending into 2027, reflecting strong market demand for its specialized equipment.
Future Growth Outlook: Looking ahead, GPM remains optimistic about the spillover effects from the expansion of advanced packaging capacity in Taiwan. Management expects the company's growth trajectory to continue, with 2027 performance projected to surpass current levels as the firm enters a period of accelerated operational realization.