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GPM's Advanced Packaging Equipment Backlog Hits Five Times Monthly Revenue
Electronic Technology · Semiconductors · cnyes · 2026-08-31
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GPM's CEO reports surging demand for advanced packaging equipment, with the company's backlog reaching five times its July revenue as Die Bonder sales accelerate.
What Happened
Surging Market Demand: GPM CEO Shi Dun-zhi highlighted that the growth of the advanced packaging equipment market has exceeded expectations, with the Die Bonder segment alone now reaching a multi-billion NTD scale. Driven by the rise of AI chips and heterogeneous integration, the demand for high-precision bonding equipment has seen a significant uptick in both volume and unit value.
Shifting Revenue Mix: Following a record-breaking July revenue of NT$689 million, GPM is undergoing a structural shift in its product portfolio. The company expects revenue from Die Bonders to officially surpass that of Chip Sorters in the second half of the year, marking a successful transition toward higher-margin, advanced packaging technologies.
Robust Order Backlog: GPM is experiencing a unique trend where new orders outpace shipments, resulting in a backlog currently valued at over five times its July revenue. The company anticipates a peak in revenue recognition from major clients over the next six to seven months, supported by its mastery of complex, high-precision manufacturing processes.
Strategic Expansion: To meet the rapid increase in orders, GPM is leveraging its G2C+ strategic alliance to expand manufacturing capacity through partners like Junhao and Eastek. Furthermore, the company has established a U.S. subsidiary to better support its major clients' global operations and further penetrate the international advanced packaging market.