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TSMC and ASML Partner on 12-inch Photomasks, Boosting Suppliers Like Gudeng
Electronic Technology · Semiconductors · economic_daily · 2026-09-09
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TSMC and ASML are collaborating to upgrade High NA EUV photomasks to 12 inches by 2030, driving stock surges for suppliers like Gudeng and Taiwan Mask Corp.
What Happened
Strategic Technology Partnership: TSMC and ASML have announced a joint initiative to transition High NA EUV photomasks from the current 6-inch standard to 12 inches. This upgrade aims to overcome existing technical limitations and enhance overall lithography productivity, with pilot lines expected by 2031 and full system readiness by 2033.
Market Reaction and Suppliers: The announcement triggered a surge in share prices for key suppliers, with Gudeng and Taiwan Mask Corp hitting daily limit-up. Gudeng’s High-NA EUV pods have already secured ASML certification, positioning the company to capture significant growth as the industry shifts toward larger photomask standards.
Extended Order Visibility: The aggressive expansion of TSMC’s advanced manufacturing processes has significantly extended order visibility for the broader supply chain. Suppliers of critical consumables, gases, and facility engineering services now report order backlogs stretching into 2028, with some facility-related projects booked through 2030.
Long-term Growth Outlook: As AI chip architectures grow in complexity, the demand for High NA EUV exposure layers is projected to rise substantially. This shift not only fuels equipment investment but also secures long-term growth prospects for the entire photomask and semiconductor materials ecosystem.