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Spirox Targets AI Glass Substrate Inspection Market with Advanced TGV Technology
Electronic Technology · Semiconductors · economic_daily · 2026-09-08
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Spirox has secured key inspection technology for TGV glass substrates, gaining traction among global semiconductor manufacturers and projecting strong growth by 2027.
What Happened
Technological Breakthrough: Spirox has successfully integrated non-linear optical tomography into semiconductor inspection, addressing critical challenges in detecting internal micro-cracks and pore wall roughness in TGV glass substrates. The company is currently the only provider certified by clients for non-destructive internal defect inspection.
Market Strategy: The firm is focusing on both TSV and TGV markets, with TSV equipment already deployed in memory 3D stacking processes. By launching specialized mass-production machines, Spirox aims to secure follow-up orders and solidify its position in the advanced packaging supply chain.
Operational Outlook: Chairman Qin Jia-qi expressed strong confidence in the company's future, forecasting significant growth by 2027. The company is transitioning its laboratory-proven technologies into mass-production lines to meet upcoming large-scale engineering validation requirements.
Market Reaction: Following the positive news regarding its TGV equipment deployment, Spirox shares surged over 8.5% in yesterday's trading session, closing at NT$146. Investors have responded favorably to the company's strategic advancements in the AI packaging sector.