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Innolux Unveils 'Chip Last' Advanced Packaging Platform, Targeting 2027 Mass Production
Electronic Technology · Semiconductors · cnyes · 2026-09-01
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Panel manufacturer Innolux has introduced its new 'Chip Last' packaging platform, leveraging high-density heterogeneous integration to target AI and HPC markets by 2027.
What Happened
Technological Milestone: Innolux has officially launched its 'Chip Last' technology platform, which utilizes high-density heterogeneous integration (HIPoS) to combine multi-layer redistribution layers with embedded cores. This strategic move is designed to strengthen the company's presence in the rapidly growing AI and high-performance computing sectors.
Operational Efficiency: By utilizing the industry's largest 620x670mm panel format, Innolux aims to maximize material utilization and reduce production costs for large-scale AI and HPC chips. The platform supports fine line/space capabilities down to 2/2µm, addressing the increasing complexity of multi-chip integration requirements.
Testing and Integration: The company has also developed a proprietary panel-level testing solution that increases testing efficiency by 50% to 80% through simultaneous multi-chip processing. This, combined with a vertical one-stop service model, allows Innolux to streamline supply chain processes and accelerate time-to-market for its clients.
Future Outlook: With the global market for fan-out panel-level packaging projected to exceed $8 billion by 2030, Innolux is repurposing its existing TFT facilities to support this transition. The company plans to collaborate with industry partners to expand into high-value applications, including optical communications, robotics, and automotive electronics.