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President Lai Ching-te Pledges to Strengthen Global Semiconductor Supply Chain Resilience
Electronic Technology · Semiconductors · cnyes · 2026-09-01
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President Lai Ching-te emphasized Taiwan's commitment to deepening international partnerships and building a resilient global semiconductor supply chain at the 2026 Chip Chain Summit.
What Happened
Industry Vision: President Lai Ching-te attended the 2026 Chip Chain Summit, highlighting Taiwan's pivotal role in the AI era and its commitment to building a resilient global semiconductor supply chain. The summit brought together representatives from 38 countries and industry leaders to discuss the future layout and technical challenges of the semiconductor sector.
Recognizing Contributions: During the event, President Lai awarded the Economic Professional Medal to SAS/GlobalWafers CEO Doris Hsu and Micron CEO Sanjay Mehrotra for their outstanding contributions to the semiconductor ecosystem. This recognition underscores the importance of corporate leadership in driving global industry development and technological innovation.
Investment Landscape: Lai noted that international giants like NVIDIA, Micron, and AMD continue to expand their investments in Taiwan, reflecting the high level of international trust in the island's semiconductor cluster. Meanwhile, TSMC is actively expanding its footprint in the U.S., Japan, and Europe, fostering global production and R&D collaboration.
Risk Management: President Lai emphasized that through global division of labor and close cooperation, nations can effectively mitigate risks from geopolitical shifts and natural disasters. This mutually beneficial model ensures stable production for all parties and creates long-term growth momentum for the global technology industry.