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Zeiss Executive Predicts 15-Year Gap for China in EUV Chip Equipment Development
Electronic Technology · Semiconductors · yonhap_finance · 2026-09-03
A top executive at Germany's Zeiss Group estimates that China remains 15 years behind in developing critical EUV lithography technology despite aggressive state investment.
What Happened
Technological Gap Assessment: Frank Rohmund, head of the semiconductor division at Germany's Zeiss Group, estimates that it will take China approximately 15 years to develop its own extreme ultraviolet (EUV) lithography equipment. This assessment aligns with recent reports from UBS analysts, who also suggest a minimum decade-long lag in China's domestic capabilities.
US Export Controls: The United States is actively restricting the export of ASML's advanced EUV machines to China to curb the country's progress in artificial intelligence. As the sole manufacturer of EUV lithography systems, ASML relies heavily on Zeiss, which provides the essential optical components required for these high-precision tools.
China's Localization Efforts: In response to tightening sanctions, China is pouring massive capital into domestic semiconductor equipment development to achieve self-sufficiency. While reports indicate that some Chinese firms are attempting to manufacture DUV lithography machines, industry experts maintain that a significant performance gap persists compared to global leaders.
Market Implications: Rohmund expressed concern that aggressive US export restrictions might inadvertently accelerate Chinese innovation, though he emphasized that global leaders currently retain a clear technological lead. The speed of China's domestic development remains a critical variable in the future stability and structure of the global semiconductor supply chain.