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WinWay Expands CPO Socket Capacity by 50% to Meet AI Demand
Electronic Technology · Electronic Equipment/Instruments · economic_daily · 2026-09-02
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WinWay is scaling up its CPO socket production by 50% by mid-2026 to support AI supply chain needs, anticipating mass adoption of CPO technology by 2028.
What Happened
CPO Development: WinWay is actively developing Co-Packaged Optics (CPO) sockets, with ten projects currently underway. The company remains at the forefront of this technology, positioning itself to capture significant market share as AI infrastructure evolves.
Capacity Expansion: To address the robust demand for AI testing interfaces, WinWay plans to increase its socket production capacity by 50% between the second and third quarters of next year. This expansion underscores the company's commitment to supporting the long-term growth of the AI supply chain.
AI Industry Outlook: WinWay dismisses concerns of an AI bubble, noting that capital expenditures across the foundry and packaging sectors are expected to rise over the next three years. The supply chain is currently in a phase of accelerated integration, with 2027-2028 expected to be a critical growth period.
CPO Market Timeline: The company views 2025 as the inaugural year for CPO development, with current efforts focused on infrastructure. Initial small-scale production is expected by late 2027, with mass adoption likely to follow from 2028 onwards.