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Wah Lee Sees Semiconductor and PCB Demand Extending Through 2030
Electronic Technology · Semiconductors · economic_daily · 2026-09-02
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Wah Lee Chairman Chang Tsun-hsien expects double-digit growth through 2027, driven by AI-fueled demand for semiconductor materials and advanced packaging.
What Happened
Industry Outlook: Wah Lee Chairman Chang Tsun-hsien stated that the rapid growth of AI is driving significant expansion in semiconductor and PCB demand. The company reports high visibility for its semiconductor materials, with some orders booked through the end of 2028 and equipment lead times extending into 2030.
Growth Drivers: The company anticipates strong performance this year and is targeting double-digit growth for next year. Key drivers include the ongoing construction of new fabs by major manufacturers, the rollout of advanced packaging capacity, and increased demand from overseas clients.
Global Strategy: As a leading provider of front-end semiconductor materials in Greater China, Wah Lee maintains strategic partnerships with Japanese firms to offer comprehensive solutions. Beyond its core Taiwan market, the company is seeing significant growth in special gas shipments to South Korea, the U.S., and Japan.
Strategic Partnerships: Wah Lee continues to serve as a critical partner to major foundries and memory manufacturers like TSMC and UMC. By focusing on process upgrades and new-generation product applications, the company expects sustained growth across both its semiconductor and PCB business segments.