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PTI Deepens Advanced Packaging Ties with AMD and Broadcom

Electronic Technology · Semiconductors · economic_daily · 2026-08-26

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Powertech Technology (PTI) is advancing its panel-level packaging projects with AMD and Broadcom, leveraging its new Hsinchu facility to capture AI chip demand.

What Happened

Advanced Packaging Milestones: PTI Chairman Tsai篤恭 confirmed that the company's panel-level packaging collaboration with AMD is progressing steadily, with production yields stabilizing ahead of a 2027 launch.

Broadcom Partnership Expansion: PTI is deepening its relationship with Broadcom by co-developing FOPLP-based packaging substrates and expanding into high-speed networking and optical communications, including a joint venture in Singapore.

Strategic Manufacturing Hub: The company's NT$50 billion Hsinchu P11 facility provides comprehensive, end-to-end AI chip packaging services, positioning PTI as a key player in the global semiconductor supply chain.

Competitive Positioning: PTI aims to leverage its unique, full-process packaging capabilities to secure a stronger market position alongside major industry players, focusing on high-growth AI and networking sectors.

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