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Powertech Technology Secures Major AI Packaging Orders from Broadcom and AMD
Electronic Technology · Semiconductors · economic_daily · 2026-08-26
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Powertech Technology's proprietary PiFO panel-level packaging technology has been adopted by major U.S. firms, with production capacity booked through 2027.
What Happened
Technological Breakthrough: Powertech Technology has successfully developed its proprietary PiFO panel-level packaging technology, which utilizes square panel layouts to enhance area efficiency and cost-effectiveness, securing orders from industry giants like Broadcom and AMD.
Production Roadmap: The company plans to begin mass production of AI chips integrating ASIC and HBM by mid-2027, while simultaneously expanding into optical communications with optical engines and CPO solutions.
Competitive Edge: Powertech’s PiFO technology offers superior flexibility and yield compared to CoWoS and EMIB, backed by a decade of R&D and over NT$20 billion in capital investment for its one-stop packaging facilities.
Financial Outlook: Analysts project that once the business reaches mass production and breaks even in 2027, it will contribute over NT$3 in earnings per share to Powertech within a single year.