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AI-Driven PCB Upgrades Spark Supply Shortages; Analysts Highlight Key Beneficiaries

Electronic Technology · Electronic Components · economic_daily · 2026-10-24

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Surging AI demand is forcing a major upgrade in PCB specifications, leading to a projected 20% supply gap for key materials by 2027, favoring major suppliers.

What Happened

Technological Upgrades: The rise of AI high-performance computing is driving a significant upgrade in PCB specifications, with a shift toward larger high-density interconnect (HDI) boards, high-layer count boards, and ABF substrates. As the cycle for doubling AI computing power shortens, the importance of the supporting material and equipment supply chain has become critical.

Supply Chain Constraints: The global race for AI infrastructure has triggered a surge in demand for PCBs and ABF substrates, causing equipment lead times to extend significantly. Analysts project that by 2027, key materials such as copper-clad laminates (CCL), copper foil, drill bits, and glass fiber cloth could face a supply-demand gap of approximately 20%.

Capacity Outlook: With visibility for capacity expansion now stretched to three or four years, the material shortage is unlikely to be resolved in the near term. As AI computing demand continues its exponential growth, the industry is expected to face tighter supply conditions starting in 2025, strengthening the pricing power of key manufacturers.

Key Beneficiaries: Analysts are bullish on major players including substrate manufacturer Unimicron, CCL producer Elite Material, and PCB manufacturer Gold Circuit Electronics. Additionally, copper foil maker Kinus and drill bit supplier Topoint, along with PTFE-related supplier Taiflex, are expected to benefit from the sustained growth in AI-driven demand.

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