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TSMC and ASML Partner to Develop 12-Inch Photomask Pilot Line by 2031

Electronic Technology · Semiconductors · yonhap_finance · 2026-09-09

TSMC is collaborating with ASML to establish a 12-inch photomask pilot line by 2031, aiming to accelerate High-NA EUV adoption and boost chip production efficiency.

What Happened

Strategic Collaboration: TSMC and ASML have announced a joint initiative to transition to 12-inch photomasks, aiming to establish a pilot production line by 2031. This partnership seeks to integrate advanced lithography systems, with a goal of achieving full-scale High-NA EUV production by 2033.

Operational Advantages: The shift to 12-inch photomasks is expected to significantly enhance manufacturing productivity and reduce costs by allowing larger circuit patterns to be printed on wafers at once. This development is crucial for meeting the rising global demand for high-performance AI semiconductors.

High-NA EUV Technology: High-NA EUV equipment is essential for sub-1.4nm logic processes and advanced memory manufacturing. By increasing the numerical aperture, this technology enables finer line widths and reduces the number of required patterning steps compared to traditional EUV tools.

Industry Outlook: TSMC leadership emphasized that industry-wide collaboration is necessary to overcome complex technical barriers and drive large-scale innovation. ASML noted that this transition will be pivotal in delivering the energy-efficient and high-speed chips that the modern market demands.

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