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UMC and AP Memory Partner to Target AI Server Power Integration Market
Electronic Technology · Semiconductors · economic_daily · 2026-10-22
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UMC and AP Memory have announced a strategic partnership to develop advanced power integration solutions for AI servers, leveraging deep trench capacitor technology to enhance power efficiency in high-performance computing.
What Happened
Strategic Partnership: UMC and AP Memory have joined forces to target the AI server power integration market by combining UMC’s deep trench capacitor (DTC) process with AP Memory’s silicon capacitor design expertise. The collaborative products have already completed tape-out and initial functional verification this quarter, with system performance and reliability testing currently underway.
Market Drivers: As AI chip performance continues to scale, power delivery architectures are shifting from the board level to the chip level to minimize transmission paths and reduce power loss. Embedding capacitors directly into interposers or packaging substrates has become essential to meet the stringent power stability requirements of high-performance computing (HPC) applications.
Technical Synergy: UMC’s senior vice president noted that DTC technology allows high-density capacitors to be placed closer to computing chips, significantly improving power stability. AP Memory’s management highlighted that the successful tape-out of their S-SiCap product marks a key milestone in demonstrating design flexibility and manufacturability for next-generation power solutions.
Future Outlook: The companies are exploring further collaboration in embedded capacitors for silicon interposers and substrate-bottom capacitors to provide a one-stop service from design to manufacturing. UMC continues to expand its power delivery portfolio, integrating advanced packaging capabilities to support the industry's transition toward higher voltage and capacity requirements in data centers.