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Mirle Automation Hits Record High on Surging Advanced Packaging Demand
Electronic Technology · Semiconductors · cnyes · 2026-09-05
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Mirle Automation's stock surged 11% to a record high this week, driven by a $15 billion order backlog fueled by semiconductor expansion and robotics growth.
What Happened
Advanced Packaging Growth: Mirle Automation is benefiting significantly from the aggressive capacity expansion of major semiconductor packaging and testing firms. The company's order backlog has surpassed NT$15 billion, signaling a robust operational outlook.
Robotics Strategy: At SEMICON TAIWAN 2026, Mirle showcased its comprehensive AI robotics and automated logistics solutions. This strategic focus on advanced packaging automation has bolstered investor confidence and driven capital inflows.
Financial Performance: July revenue reached NT$863 million, marking a 34-month high with a 62.1% year-over-year increase. With cumulative revenue for the first seven months up 25.6%, the company is on track to potentially exceed NT$10 billion in annual revenue for 2026.
Market Activity: Institutional investors were net buyers this week, with foreign investors accumulating over 11,000 shares. Despite some profit-taking at higher levels, the stock closed at NT$211, reflecting an 11.34% weekly gain after hitting a record high of NT$224.