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Topco Scientific to Showcase Advanced Packaging and Silicon Photonics at SEMICON Taiwan
Electronic Technology · Semiconductors · economic_daily · 2026-08-24
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Topco Scientific will debut its advanced packaging cooling solutions and silicon photonics models at SEMICON Taiwan 2026 to capture AI and HPC market growth.
What Happened
Showcasing Innovation: Topco Scientific is set to participate in SEMICON Taiwan 2026, held from September 2 to 4, where it will unveil its latest models for advanced packaging cooling and silicon photonics co-packaging. These technologies are strategically positioned to capitalize on the surging demand for AI and high-performance computing (HPC).
Addressing Packaging Challenges: To tackle the thermal management issues associated with kilowatt-level AI chip power consumption, Topco is offering sapphire single-crystal substrates. This material provides superior resistance to warping and high light transmittance, effectively resolving common issues found in traditional glass carriers during high-temperature processes.
Enhancing Yield and Performance: CEO Chen De-Yi emphasized that as advanced packaging structures become increasingly complex, material selection has become a critical factor in determining chip performance and manufacturing yields. The company's high-end material offerings are designed to meet the rigorous requirements of next-generation chip production.
Strategic Market Positioning: Through this exhibition, Topco highlights its leadership in integrated semiconductor material services. The company remains committed to deepening client partnerships and providing the advanced material technologies necessary to support the rapid evolution of the AI and HPC industries.