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Xiaomi Unveils Xring O3 Chip: Reportedly Tapping TSMC 3nm for Flagship Foldables

Electronic Technology · Semiconductors · cnyes · 2026-08-24

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Xiaomi has introduced its latest self-developed Xring O3 processor, which is reportedly manufactured using TSMC's 3nm process to power upcoming flagship foldables.

What Happened

Strategic Chip Development: Xiaomi has officially unveiled its next-generation flagship processor, the Xring O3, marking a significant step in its efforts to enhance supply chain autonomy. This move is designed to reduce the company's reliance on major external suppliers like Qualcomm and MediaTek.

Manufacturing Partnership: Industry reports indicate that the new chip will be produced using TSMC's 3nm process technology. While both companies have remained silent on the specifics of the manufacturing agreement, initial production targets are estimated to be between 200,000 and 300,000 units.

Performance and Integration: Although the 3nm process lags slightly behind the 2nm technology expected from competitors, the Xring O3 is projected to exceed 4GHz in clock speed with improved power efficiency. The chip is slated for integration into Xiaomi's upcoming flagship foldable smartphones, the Xiaomi 18 Ultra, and the Pad 8S Pro.

Market Trajectory: Xiaomi's previous iteration, the Xring O1, has already seen over one million units shipped across various devices since its debut in 2025. With the introduction of the Xring O3, the company aims to further solidify its competitive position in the high-end mobile hardware market.

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