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TPK-KY Expands into Semiconductor Packaging with New TGV Line and Thailand Facility
Electronic Technology · Semiconductors · cnyes · 2026-08-21
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TPK-KY is pivoting toward semiconductor packaging, with its TGV pilot line starting in September and a new Thailand plant set for production early next year.
What Happened
Strategic Pivot: TPK-KY is aggressively entering the semiconductor sector, leveraging its expertise in glass processing to develop glass substrates for advanced packaging, which offer superior thermal management for AI chips and high-end ASICs compared to organic substrates.
Pilot Line Launch: The company's Through-Glass Via (TGV) pilot line in Zhongli is scheduled to begin operations in early September, with collaborations already underway with major packaging and testing firms for applications including carriers and high-end interposers.
Overseas Expansion: Construction of the new production facility in Thailand is complete, with the company currently installing equipment and performing system integration; the plant is expected to begin trial runs by year-end and ramp up to mass production early next year.
Synergy and Growth: Beyond TGV technology, TPK-KY is utilizing its stake in driver IC maker Ilitek to integrate resources and secure its position in the semiconductor supply chain, aiming to build a dual-engine growth strategy for its semiconductor business.