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Powertech Technology Accelerates CPO Strategy with Micro-Bump Optical Engines
Electronic Technology · Semiconductors · cnyes · 2026-08-26
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Powertech Technology is pushing into the silicon photonics market, aiming to mass-produce its micro-bump optical engines by next year to support AI computing.
What Happened
Strategic Development: Powertech Technology (PTI) has unveiled its latest advancements in silicon photonics and Co-Packaged Optics (CPO). The company plans to ship its micro-bump optical engines for client verification by the end of this year, with mass production targeted for 2027.
Addressing AI Bottlenecks: As AI computing demands explode, traditional electrical signal transmission is hitting thermal and power limits. PTI emphasizes that CPO technology, which integrates optical fibers directly into chip packages, is essential for overcoming latency and energy efficiency challenges in data centers.
Competitive Edge: Unlike some competitors using hybrid bonding, PTI is leveraging its cost-effective micro-bump technology for vertical stacking. The company has already produced engineering samples and is developing four distinct packaging modes for network switches and high-performance computing applications.
Market Positioning: Chairman Tsai Tu-kung noted that PTI is among the few global players capable of full-scale CPO packaging, alongside TSMC. The company is also exploring panel-level integration to further enhance transmission efficiency and reduce production costs as it scales its advanced packaging business.
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