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NARLabs and imec Host Chip Innovation Forum to Deepen Taiwan-EU Ties
Electronic Technology · Semiconductors · cnyes · 2026-09-10
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NARLabs held the 2026 Taiwan-EU Chip Innovation Forum in Belgium, focusing on advanced packaging and silicon photonics to strengthen global supply chain resilience.
What Happened
Forum Overview: The National Applied Research Laboratories (NARLabs) hosted the 2026 Taiwan-EU Chip Innovation Forum in Belgium on September 9-10, aiming to build a resilient international chip ecosystem. Minister of the National Science and Technology Council, Wu Tsung-tsong, emphasized that Taiwan and Europe share core values of innovation and trust, advocating for complementary cooperation in advanced manufacturing.
Technical Focus: The forum explored cutting-edge technologies including silicon photonics, advanced packaging, smart sensing, and compound semiconductors. Experts from both regions engaged in in-depth discussions on emerging materials and 3D integrated circuit technologies.
Talent Development: NARLabs President Tsai Hong-ying highlighted that talent is the cornerstone of industrial development. Facing a global shortage of semiconductor professionals, the forum aims to bridge Taiwan's practical education strengths with Europe's academic depth to foster cross-border learning opportunities.
International Collaboration: Featuring industry leaders such as UMC, the event showcased Taiwan's R&D capabilities through various exhibitions. This platform serves to strengthen supply chain resilience and paves the way for future cooperation in AI, quantum computing, and space technology.