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Intel and Samsung Join TSMC in Adopting ASML's Next-Gen 12-Inch Reticle Technology
Electronic Technology · Semiconductors · cnyes · 2026-09-08
2330
Intel and Samsung have announced their participation in ASML's 12-inch reticle platform, aiming to boost production efficiency and reduce costs in advanced chip manufacturing.
What Happened
Technological Shift: Intel and Samsung have joined TSMC in committing to ASML's next-generation 12-inch reticle technology. This industry-wide shift from traditional 6-inch reticles is expected to significantly improve manufacturing efficiency and reduce costs for advanced semiconductor nodes.
Intel's Strategy: Intel is already utilizing High NA EUV for its Panther Lake processors. The company is employing a dual-track strategy, optimizing 6-inch reticle stitching while actively preparing for the transition to the larger 12-inch standard to ensure high-volume production readiness.
Samsung's Roadmap: Samsung is not only supporting the 12-inch reticle initiative but also plans to integrate High NA EUV into its DRAM production by 2028. This move aims to leverage their expertise in both memory and foundry services to maintain a competitive edge in the AI-driven semiconductor market.
Ecosystem Development: The collaboration among these industry giants underscores the expanding ecosystem for High NA EUV, which now encompasses reticle manufacturing, EDA software, and specialized materials. Establishing a 12-inch standard is seen as a critical step to overcoming current limitations in exposure fields and manufacturing complexity.
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