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August 25 Financial Briefing: US Bond Buyback Plans, Fubon Financial Outlook, and Intel's Packaging Win
Electronic Technology · Semiconductors · economic_daily · 2026-08-24
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A roundup of five key financial stories for August 25, covering US Treasury bond buyback plans, Fubon Financial's market outlook, Intel's new packaging partnership, and Taiwan's industrial policy updates.
What Happened
US Treasury Market Intervention: Senior US Treasury officials have indicated plans to utilize nearly $1 trillion from the Treasury General Account (TGA) to fund a bond buyback program. Analysts expect this move to exert downward pressure on long-term bond yields and improve market stability.
Fubon Financial Market Outlook: During its Q2 earnings call, Fubon Financial President Han Wei-ting expressed confidence in the fundamentals of Taiwan's AI sector. He anticipates that the stock market will likely experience high-level volatility throughout the fourth quarter.
Intel's Advanced Packaging Expansion: Intel has secured a significant deal with SK Hynix, which will incorporate Intel's EMIB advanced packaging technology into its next-generation High Bandwidth Memory (HBM). This partnership strengthens Intel's position in the high-performance memory supply chain.
Industrial and Biotech Policy: The Federation of Industries has highlighted the persistent labor shortage as a top concern in its 2026 white paper, urging government action on energy and transformation policies. Meanwhile, the government is advancing a two-stage strategy to build biomedical big data infrastructure to capture global market opportunities.