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Zhen Ding Tech Breaks Ground on New Shenzhen Facility to Boost AI Packaging Capacity
Electronic Technology · Electronic Components · economic_daily · 2026-09-21
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Zhen Ding Tech's subsidiary, Leadtek, has begun construction on four new factories in Shenzhen to expand its high-end ABF substrate production for AI and HPC markets.
What Happened
Expansion Strategy: Zhen Ding Tech's subsidiary, Leadtek Semiconductor, has broken ground on a new manufacturing base in Shenzhen with an investment of at least 12 billion RMB. The project involves the construction of four factories dedicated to high-end ABF substrates to support the growing demand for AI and advanced packaging.
Growth Outlook: The company expects strong momentum in the second half of the year, driven by peak consumer electronics demand and the scaling of AI server and optical module products. Zhen Ding aims to solidify its long-term growth trajectory and reach the top five global IC substrate manufacturer ranking by 2030.
Financial Performance: Zhen Ding reported a 19.8% year-on-year increase in cumulative revenue for the first eight months of the year. Net profit for the first half more than doubled, with the revenue contribution from servers, optical modules, and IC substrates rising to 21.6%.
Corporate Restructuring: The group is streamlining operations by merging its subsidiaries, Qing Ding Precision and Hong Heng Sheng Electronics. This integration, effective September 30, is designed to optimize resource allocation and management efficiency without impacting shareholder equity.
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