News / Taiwan / cnyes
Grand Process Technology Invests in Japan's Aoi Materials to Localize Hybrid Bonding
Electronic Technology · Semiconductors · cnyes · 2026-08-27
3131
Grand Process Technology has finalized a strategic investment in Japan's Aoi Advanced Materials, transitioning from a distributor to a technical partner to localize advanced semiconductor bonding solutions in Taiwan.
What Happened
Strategic Investment: Semiconductor equipment manufacturer Grand Process Technology (3131-TW) has finalized its first-phase strategic investment in Japan's Aoi Advanced Materials. This move elevates their partnership from a simple distribution agreement to a technical equity collaboration, aimed at localizing advanced bonding technologies in Taiwan.
Core Technology Integration: Aoi Advanced Materials holds exclusive rights to cutting-edge technologies developed by the University of Tokyo, including Hybrid Bonding, Surface Activated Bonding (SAB), and Focus Super Atom Beam polishing. These innovations are critical for enhancing the performance, thermal management, and power efficiency of next-generation AI and HPC chips.
Supply Chain Localization: Leveraging its expertise in equipment manufacturing and local supply chain integration, Grand Process Technology will establish a local center for bonding equipment and material solutions. This initiative is expected to significantly shorten lead times and validation processes for major foundry and advanced packaging clients.
Industry Impact: CEO Chang Hung-tai stated that bonding technology is a critical node for chip performance, marking this investment as a milestone in deepening advanced technical capabilities within Taiwan. The company aims to leverage its manufacturing prowess to ensure Taiwan maintains its global leadership in the advanced packaging sector.