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Advanced Packaging Takes Center Stage at SEMICON Taiwan 2026
Electronic Technology · Semiconductors · economic_daily · 2026-09-04
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SEMICON Taiwan 2026 highlights advanced packaging and testing, with analysts bullish on equipment suppliers benefiting from increased industry capital expenditure.
What Happened
Focus on Advanced Packaging: SEMICON Taiwan 2026 continues to emphasize advanced packaging and testing as the primary drivers of industry growth. Analysts expect that sustained capital expenditure from major foundries and OSAT providers will generate significant momentum for the equipment supply chain.
Diversified Equipment Demand: The exhibition highlights a broader customer base, with strong demand from OSAT providers, US-based IDMs, and memory manufacturers. Equipment suppliers are increasingly integrating AI to optimize design processes and overcome manufacturing bottlenecks.
Technological Advancements: Key themes include CoWoS, 3D packaging, and panel-level packaging, with a notable increase in CPO and TGV solutions. Despite market rumors regarding potential chip specification adjustments, the demand for equipment upgrades remains robust.
Beneficiaries of Industry Upgrades: Analysts remain optimistic about companies like CHPT, which are well-positioned to address the complexities of modern chip design. With successful technology integration and ongoing equipment validation, these firms are expected to capitalize on the industry's shift toward more advanced manufacturing processes.
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