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日月光, King Yuan Electronics, and CHPT Ramp Up Capacity for AI Chip Testing
Electronic Technology · Semiconductors · economic_daily · 2026-09-20
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As AI and HPC chips evolve toward heterogeneous integration, testing complexity is surging, prompting major Taiwanese firms to expand high-end capacity.
What Happened
Technical Evolution: Teradyne highlights that the shift toward Chiplet and heterogeneous integration in AI and HPC chips has significantly increased testing complexity. Testing has evolved from a routine quality control step into a critical phase for ensuring the performance of high-power AI processors.
Equipment Upgrades: To address the needs of large-die and high-power chips, Teradyne has introduced the UltraFLEXplus testing system, capable of delivering massive current. This technology is designed to meet the rigorous high-frequency and high-power testing requirements of modern data center chips.
Industry Expansion: Major Taiwanese OSAT providers are aggressively expanding capacity. ASE Technology is investing in advanced testing platforms, while King Yuan Electronics has raised its capital expenditure to a record NT$50 billion to support AI GPU and ASIC testing requirements.
Market Outlook: Companies like Chunghwa Precision Test Tech are also upgrading their probe card and testing board technologies to handle higher power consumption. As the AI supply chain deepens its reliance on advanced packaging and testing, these firms are well-positioned to capture significant growth.
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