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Apple's Upcoming Foldable iPhone Boosts Outlook for TSMC and Foxconn
Electronic Technology · Semiconductors · economic_daily · 2026-09-08
2317, 2330
With Apple's fall event approaching, analysts are bullish on TSMC and Foxconn, citing the upcoming foldable iPhone Ultra and 2nm chip integration.
What Happened
Product Launch Anticipation: Apple's fall event on the 10th is set to unveil the company's first foldable smartphone, the iPhone Ultra, alongside the iPhone 18 Pro series. This launch marks a significant milestone under new CEO John Ternus, with expectations for enhanced performance.
Supply Chain Synergy: The iPhone 18 series will feature the A20 Pro chip, manufactured using TSMC's 2nm process, promising a 10-15% performance boost. Foxconn remains the primary assembly partner, reinforcing its critical role in Apple's hardware ecosystem.
Market Projections: Analysts forecast that Apple could capture a 24% share of the global foldable smartphone market by 2027. Strong sales projections for the iPhone 18 Pro series over the next two years are expected to drive significant revenue for key suppliers.
Analyst Sentiment: Institutional investors remain overwhelmingly positive on both TSMC and Foxconn. With high price targets set by major brokerages, the market is showing strong confidence in the potential of Apple's new product cycle to drive long-term growth.