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FCS Targets Advanced Packaging Market with Glass Substrate Equipment
Producer Manufacturing · Industrial Machinery · economic_daily · 2026-10-18
FCS CEO Wang Jun-hsien outlines a dual-track strategy focusing on MLPC capacitors and glass substrate equipment to capture growth in advanced packaging.
What Happened
Operational Strategy: FCS CEO Wang Jun-hsien has unveiled a dual-track growth strategy, leveraging MLPC solid-state capacitor technology and glass substrate manufacturing equipment to drive future revenue.
Market Opportunity: As the semiconductor industry scales up advanced packaging, glass substrates are emerging as a critical component. FCS anticipates significant growth in its equipment business between 2028 and 2030 as adoption accelerates.
Technological Focus: The company is concentrating its R&D efforts on high-end packaging equipment to solidify its role within the semiconductor supply chain.
Future Outlook: FCS aims to transform its business model by focusing on high-growth segments, expecting these strategic investments to significantly enhance its long-term financial performance.