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CPO Testing Hurdles Create Opportunities for Equipment Makers Like MPI and Chroma
Electronic Technology · Semiconductors · economic_daily · 2026-10-24
As Co-Packaged Optics (CPO) technology moves toward mass production, the high complexity of optoelectronic testing has positioned specialized equipment providers for growth.
What Happened
CPO Production Bottlenecks: While Co-Packaged Optics (CPO) technology has officially entered the production phase, the yield and testing of Photonic Integrated Circuits (PICs) remain significant hurdles. The ability to scale production next year depends heavily on overcoming these complex testing challenges.
Technical Testing Challenges: CPO testing requires precise micron-level fiber alignment and simultaneous optoelectronic measurement, which is significantly more complex than traditional IC testing. Currently, the lack of standardized, automated testing processes limits the speed and scalability of CPO module manufacturing.
Critical Testing Stages: The testing process involves four distinct stages, with the second stage—involving the optoelectronic testing of bonded EIC and PIC chips—being the most technically demanding. Failure to optimize these stages leads to high scrap costs, making efficient testing a decisive factor for profitability.
Equipment Market Outlook: With major players like NVIDIA accelerating CPO deployment, the demand for advanced testing equipment is expected to surge. Companies such as MPI Corporation and Chroma ATE are well-positioned to benefit as the industry moves toward high-volume production in the second half of next year.