News / Taiwan / cnyes
TSMC and AMD Advance Next-Gen Liquid Cooling Tech, Targeting Mid-2025 Mass Production
Electronic Technology · Semiconductors · cnyes · 2026-09-01
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TSMC and AMD are collaborating on 'TIM-less' liquid cooling technology to tackle AI chip thermal bottlenecks, with mass production expected by mid-2025.
What Happened
Technological Breakthrough: Rising power consumption in AI chips has made thermal management a critical bottleneck for performance. TSMC and AMD have unveiled a roadmap for next-generation liquid cooling, focusing on 'TIM-less' technology that integrates cold plates directly into the package to eliminate thermal interface materials.
Architectural Optimization: AMD is pursuing 'Lidless Package' designs to shorten thermal paths and improve cooling efficiency. TSMC aims to minimize thermal resistance by allowing cold plates to make direct contact with chips, a necessary evolution to support future AI computing modules requiring thousands of watts of power.
Production Timeline: Industry sources indicate that the technology is currently in development, with mass production expected to begin as early as mid-2025 alongside new client platforms. The manufacturing process requires coordination between advanced packaging facilities and system assemblers to ensure seamless integration of the cold plates.
Supply Chain Impact: Key Taiwanese cooling and equipment manufacturers, including Auras, AVC, and Jentech, are actively developing these next-gen cold plates. Additionally, companies like Hotron are providing the specialized equipment needed for the bonding processes, positioning these firms to capture significant market share in the AI liquid cooling sector.
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